TI Acquires Integrated Circuit Designs, Inc. to Expand Low-Power RF Design Resources
This acquisition is the latest strategic move by TI to strengthen its low-power RF portfolio and follows the successful acquisition of Chipcon, a leading provider of short-range, low-power RF transceivers for ZigBee®-compliant and proprietary-based wireless systems.
"With the rapidly growing demand for industrial, commercial and residential systems to incorporate more short-range wireless technology, it is important for TI to provide a broad portfolio of innovative RF devices. The addition of ICD's design expertise will complement our existing low-power wireless business and enhance our ability to offer customers complete RF solutions," said David Jones, Precision Analog business manager at TI.
Edward Chalfin, founder, chairman and president of ICD, said, "We are very excited to join Texas Instruments and expand TI's existing design resources and expertise in the field of low-power RF."
ICD was founded in 1995 to provide consulting services in analog and mixed-signal IC design. In addition to its core analog IC design expertise and IP portfolio, ICD's capabilities include physical layout, test engineering and project management. ICD is based in Ellicott City, Maryland, and has 16 employees. Terms of the transaction were not disclosed.
|
Related News
- Shenzhen Integrated Circuit Design Industrial Center Licenses Low-Power Cores from MIPS Technologies
- Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering
- ARM Unveils Cortex-A9 Processors For Scalable Performance and Low-Power Designs
- Mentor Graphics Introduces Smallest Footprint, Industry-Compliant Serial ATA PHY for Optimized Low-Power Designs
- Cadence Speeds Adoption of Wireless and Consumer Low-power Designs with Low-power Methodology Kit
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |