Synopsys was not invited to join SystemVerilog OVM initiative
(08/17/2007 6:43 AM EDT)
LONDON — Synopsys Inc., a leading supplier of EDA tools, intellectual property, and design services, was not invited to join the Open Verification Methodology (OVM) initiative recently announced by Cadence Design Systems Inc. and Mentor Graphics Corp.
Cadence (San Jose, Calif.) and Mentor (Wilsonville, Ore.) announced they had joined forces to promote a common approach to the verification of design files based on the SystemVerilog language on Thursday (Aug. 16). They called have called it the 'Open Verification Methodology' or OVM to emphasize that it is an open-source and freely available approach. Executives from the companies claimed that two-thirds of the verification market would support the approach.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- Imperas Collaborates with Synopsys on SystemVerilog based RISC-V Verification
- eMemory and PUFsecurity Join DARPA Toolbox Initiative
- Synopsys Awarded DARPA Electronics Resurgence Initiative Contract for Advanced Emulation Technology
- Synopsys Expands embARC Initiative to Include Additional ARC Processors and Open Source Projects to Accelerate Development of Embedded Systems
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation