Letter to the editor: IP holds the SoC key (Bob Tait, S3)
I received a plethora of e-mails regarding my recent article, entitled "Opinion: Semi IP sector is a lost cause"
Then, I asked for the IP vendors themselves to respond to a set of questions. Here's one letter to the editor:
Editor,
IP is the bedrock of the SoC industry. Who can imagine designing a SoC on a leading-edge process, such as 90nm, 65nm or below, without using IP in the form of processors, memories, standard cells, I/Os, application-specific function blocks and mixed-signal converters?
IP holds the key to the future of the semiconductor industry and there are many talented engineers who are working hard to deliver the full potential of these intellectual property building blocks.
The beauty of these IP blocks or cores revolves around the fact that they are industry-standard, reusable, energy efficient, versatile and can meet the time-to-market, time-to-revenue demands of semiconductor designers and their end customers. The availability of these IP building blocks helps speed the actual design onto a system-on-a-chip, thus addressing performance, market timing and form- factor issues.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- AMD and Key Industry Partners Welcome the AMD Opteron A1100 SoC to the 64-bit ARM Datacenter Arena
- Ambarella S3 IP Camera SoC Delivers Outstanding 4K Video Quality Using State-of-the-Art H.265/HEVC Encoding
- S3 Group licenses custom ADC and DAC Solution to Avalent Technologies' SoC Platforms
- S3 Group and Cognovo to accelerate Software Modem System-on-Chip Design
- ADTechnology Selects S3 Group to Customize a Baseband ADC and Power Management Solution for its Digital Multimedia Broadcasting (T-DMB) System on Chip (SoC)
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation