Sonics files for IPO
(08/27/2007 10:42 AM EDT)
LONDON -- Sonics Inc. (Mountain View, Calif.) has filed forms with the Securities & Exchange Commission for an initial public offering of common stock.
Sonics provides interconnect intellectual property and EDA tools to configure it for use joining blocks together on system chips. According to one report Sonics is looking to raise $80 million in the IPO.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Mobileye files for IPO, reveals data
- OPENEDGES Files Registration Statement for the Initial Public Offering (IPO)
- GlobalFoundries Files Registration Statement for Proposed Initial Public Offering
- eASIC Files Registration Statement for Proposed Initial Public Offering
- China's VeriSilicon Files For IPO
Breaking News
- Creonic Introduces Doppler Channel IP Core
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
- YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
- SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
Most Popular
- Imagination pulls out of RISC-V CPUs
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
- RISC-V in AI and HPC Part 1: Per Aspera Ad Astra?
- Synopsys Responds to the European Commission Approving its Proposed Acquisition of Ansys in Phase 1