Tensilica plans IPO, CEO says
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
K.C. Krishnadas, EE Times(10/22/2007 10:09 AM EDT)
BENGALURU, India — Configurable processor specialist Tensilica Inc. said it is planning an initial public offering.
"As we grow, we have a natural need to continuously expand our R&D investment and sales channels, and to develop the option of acquiring key capabilities," said Chris Rowen, Tensilica's president and CEO (Santa Clara, Calif.). "While our business is not particularly capital intensive, an IPO gives us powerful flexibility."
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
Breaking News
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
- Sevya joins TSMC Design Center Alliance
Most Popular
- Weebit Nano nears productisation, negotiating initial customer agreements
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
- Sevya joins TSMC Design Center Alliance
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
- Open Compute Project Foundation and JEDEC Announce a New Collaboration