USB 3.2 Gen2x2 with PIPE 4.3 and USB2.0 with UTMI+ interface
John Danforth Resigns as Rambus Senior Legal Advisor
"We want to thank John for his years of hard work and loyal service," said Tom Lavelle, senior vice president and general counsel for Rambus. "The Company had significant litigation successes during his tenure. The Company is particularly pleased with, among other things, John's work in defending the Company's intellectual property rights, including obtaining positive outcomes in the Court of Appeals for the Federal Circuit in the Infineon case, and in the first two phases of the ongoing Hynix patent case. In these and other areas, the Company overcame significant legal hurdles, which John and his team addressed in a highly professional and effective manner. We thank John for his years of hard work for Rambus and wish him the best in his future endeavors."
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
|
Rambus Inc. Hot IP
Related News
- Rambus Co-Founder Mike Farmwald to Serve as Senior Technical Advisor
- Rambus Announces James Mitarotonda to Become Board Advisor
- Rambus Announces New Senior Vice President of Global Market Development
- Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
- ITC Issues Notice of Final Determination in Rambus Matter Regarding NVIDIA Products
Breaking News
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
- Sevya joins TSMC Design Center Alliance
Most Popular
- Weebit Nano nears productisation, negotiating initial customer agreements
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
- Sevya joins TSMC Design Center Alliance
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
- Open Compute Project Foundation and JEDEC Announce a New Collaboration
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |