Rambus Signs Memorandum of Understanding with Intel
Company to provide technology and design resources for evaluation effort of XDR™ memory architecture
Los Altos, California, United States -- Nov. 07, 2007 -- Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, has signed a memorandum of understanding with Intel to explore possible uses for Rambus' family of XDR™ memory solutions.
Rambus plans to dedicate certain technology and design resources to the effort and the evaluation will be done on Intel’s silicon process technology. The Company stressed that Intel was only evaluating the technology for possible future uses and has no specific product plans for the XDR memory technology at this time.
The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for scalable point-to-point signaling on the data bus.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
|
Rambus Inc. Hot IP
Related News
- Rambus Signs Memorandum of Understanding with Spansion
- Tower Semiconductor Signs Memorandum of Understanding to Significantly Improve Its Balance Sheet and Financial Position
- Verimatrix signs a binding agreement to sell its Silicon IP business unit to Rambus
- Rambus Signs Agreement to Acquire Silicon IP and Secure Protocols Business from Verimatrix
- Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd.
Breaking News
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Rambus and AMD Extend Patent License Agreement
Most Popular
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
- SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |