Leica Geosystems selects Wipro-NewLogic to provide turnkey IC design & supply chain management services
Lustenau, Austria -- December 10, 2007 -- Wipro-NewLogic, the European IC design and semiconductor IP (Intellectual Property) business of Wipro Technologies has been selected by Leica Geosystems AG, a leading provider of spatial information products, to provide turnkey IC supply services to support the launch of new laser measurement products.
Wipro Technologies is an independent design services provider working on complete product development including IC design services and IP (Intellectual property) for complex digital, mixed signal and RF IC developments. Wipro-NewLogic is the European IC design and semiconductor IP group of Wipro Technologies. It supports semiconductor and system companies in the IC design services area and also offers semiconductor IP. The team provides services from system-engineering, IC design and final layout through to test development, characterization and supply-chain management of packaged and tested components.
Wipro-NewLogic helped Leica Geosystems Precision Tools Division to develop a key ASIC used in Leica DISTO laser measurement products and is now supplying these ASICs directly to Leica Geosystems product manufacturing facility. Leica Geosystems strives to provide the highest possible product quality and reliability. Wipro-NewLogic was selected to supply the ASIC as its design expertise allowed Wipro-NewLogic to develop a very comprehensive test program to assist Leica Geosystems in meeting its quality goals.
“It was most important for us that the production started as scheduled and that the test works reliably and stably” stated Reto Metzler, Senior Design Engineer Electronics at Leica Geosystems. “Wipro-NewLogic managed to commence delivery of production components ahead of our demanding schedule and we are very pleased with the results.”
“We are delighted, that Leica Geosystems selected Wipro-NewLogic as their Turnkey ASIC Design services and Supply chain management Partner”, says Senthil Murugesan, Vice President and CEO at Wipro-NewLogic. “Leica Geosystems originated the use of lasers in distance measurement equipment and so it is a privilege to support Leica Geosystems in developing and manufacturing their outstanding products.”
Leica Geosystems – when it has to be right
With close to 200 years of pioneering solutions to measure the world, Leica Geosystems products and services are trusted by professionals worldwide to help them capture, analyze, and present spatial information. Leica Geosystems is best known for its broad array of products that capture accurately, model quickly, analyze easily, and visualize and present spatial information.
Those who use Leica Geosystems products every day trust them for their dependability, the value they deliver, and the superior customer support. Based in Heerbrugg, Switzerland, Leica Geosystems is a global company with tens of thousands of customers supported by more than 2,400 employees in 22 countries and hundreds of partners located in more than 120 countries around the world. Leica Geosystems is part of the Hexagon Group, Sweden.
About Wipro- NewLogic
Wipro-NewLogic is a leading semiconductor design services provider and supplier of IP cores for complex wireless and wireline applications; thanks to its expertise in complex transceivers, its CMOS RF and its design services capabilities, Wipro-NewLogic has become the partner of choice to design digital, RF and mixed signal CMOS SoCs (system-on-chip).
Wipro-NewLogic's IP portfolio includes Wireless LAN (IEEE 802.11), Bluetooth, Ultra WideBand (UWB) and FireWire (IEEE1394). The IP cores consist of software, digital signal processing & algorithms, silicon proven CMOS radios (RF) and mixed-signal blocks such as AFEs, ADC/DACs, PLLs.
Wipro-NewLogic's turnkey services cover the whole process of IC design, from feasibility studies to digital/analog/RF design, including the development of complete RF-plus-digital SoCs, engineering sample evaluation, test program development, device characterization, reliability testing, and management of the IC production supply chain including wafer sourcing, device packaging & test.
|
Related News
- ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal
- Outsourcing Supply Chain Management for chip manufacture can increase yields and quality
- "Onshoring" chip production is a red herring: the UK should double down on its competitive advantage in R&D and IP to create a secure semiconductor supply chain
- Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
- T&VS and Blackpepper Technologies announce strategic partnership to provide turnkey end-to-end SoC implementation services
Breaking News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |