Oki licenses 16-bit general-purpose core from DSP Group
![]() |
Oki licenses 16-bit general-purpose core from DSP Group
By Semiconductor Business News
April 5, 2000 (11:50 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000405S0015
SANTA CLARA, Calif. -- Seeking to strengthen its position in the consumer product arenas, Oki Electric Industry Co. Ltd., of Tokyo, has licensed TeakLite, a 16-bit general-purpose DSP core from DSP Group Inc. Oki also holds a license for DSP Group's OakDSPCore. The TeakLite DSP core is designed for low-power, low-voltage and high-speed DSP applications, such as wireless communication, modems, advanced telecommunication systems and embedded-control applications. Integrating the DSP Group core technology with its in-house mixed-signal capabilities will enable Oki to enhances its System LSI offerings in applications where high-performance signal processing is required, according to the company. "We believe that TeakLite, with its low power and high-performance capabilities, will become a key ingredient in the design of many Oki Silicon Platform Architecture (SPA) LSI solutions," said Tetuzo Taniguti, general manager of Oki's LSI division.
Related News
- Hot Embedded DSP Market Almost Twice the General-Purpose DSP Market, According to New Forward Concepts Study
- CMX Systems announces unique, embeddable SNMP functionality for CMX-MicroNet TCP/IP stack for 8-bit, 16-bit and DSP processors
- Hot Embedded DSP Market Almost Twice The General-Purpose DSP Market According To New Forward Concepts Study
- STMicro doubles speed of 16-bit MCU, adds DSP functions
- Improv moves Jazz DSP core into high-volume 16-bit markets
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |