Transmeta Appoints Dan Hillman as Vice President of Engineering
Update: Intellectual Ventures has acquired Transmeta Patent Portfolio on Jan. 28, 2009
SANTA CLARA, CA. - Dec 21, 2007 - Transmeta Corporation today announced that Dan Hillman has joined its executive team as vice president of engineering. Mr. Hillman will report to Les Crudele, president and CEO of Transmeta, and will be responsible for managing the company's engineering, research and development efforts.
"I am pleased to welcome Dan to our team as vice president of engineering," said Mr. Crudele. "Dan brings to Transmeta over 35 years of experience across a variety of sectors including IP licensing, chip design, and electronic design automation (EDA), all of which are applicable to Transmeta as we work to promote the adoption of our LongRun2 Technologies by a broader market."
Mr. Hillman's diverse background spans a range of technology companies and disciplines relevant to Transmeta's business. Before joining Transmeta, Mr. Hillman served as vice president of Engineering for MOSAID Technology, a licensor of semiconductor intellectual property. Mr. Hillman joined MOSAID as a result of MOSAID's acquisition of Virtual Silicon Technology, a privately held supplier of semiconductor intellectual property, where Mr. Hillman served as vice president of engineering through its acquisition by MOSAID in 2005. Before joining Virtual Silicon, Mr. Hillman served as vice president of engineering for inSilicon, a provider of communications semiconductor intellectual property, which was acquired by Synopsys. Previously, he was also the Corporate Application Group director for the Physical Synthesis Business Unit of Synopsys for eight years. Mr. Hillman also spent 11 years at Apple Computer as a hardware manager where he was directly involved in the design of the Apple IIGS and Macintosh computers, and also led a team that developed the IEEE 1394 (Firewire) Serial Bus. He began his career at RCA Corporation and Zilog Corporation.
Mr. Hillman holds a B.S. in Electrical Engineering from Purdue University.
About Transmeta Corporation
Transmeta Corporation develops and licenses innovative computing, microprocessor and semiconductor technologies and related intellectual property. Founded in 1995, we first became known for designing, developing and selling our highly efficient x86-compatible software-based microprocessors, which deliver a balance of low power consumption, high performance, low cost and small size suited for diverse computing platforms. We are presently focused on developing and licensing our advanced power management technologies for controlling leakage and increasing power efficiency in semiconductor and computing devices, and in licensing our computing and microprocessor technologies to other companies. To learn more about Transmeta, visit www.transmeta.com.
|
Related News
- Sankalp Semiconductor Appoints Sathish Kumar Ganesan as Vice President Engineering
- Tortuga Logic Appoints Andrew Dauman Vice President of Engineering to Oversee Product Development, R&D
- Kilopass Appoints Jen-Tai Hsu Vice President of Engineering
- Ambiq Micro appoints Dale Hancock as Vice President of Engineering
- Kilopass Appoints Pioneer NVM Developer Christophe Chevallier Vice President of Engineering to Drive Kilopass NVM Memory Enablement
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |