SuperH names executives at RISC chip venture between Hitachi and STMicro
![]() |
SuperH names executives at RISC chip venture between Hitachi and STMicro
By Semiconductor Business News
December 7, 2001 (8:45 p.m. EST)
URL: http://www.eetimes.com/story/OEG20011207S0108
SAN JOSE -- SuperH Inc.--a developer of 32-bit and 64-bit embedded microprocessors--announced the completion of its executive staff. Established in July of 2001, SuperH is a joint venture between STMicroelectronics Inc. and Hitachi Ltd. SuperH is an independent entity that develops processor cores, based on Hitachi's SH-4 RISC technology. SuperH--which is based in San Jose--will be headed by Toshimasa Kihara, formerly general of the Microprocessor and IC Division at Hitachi. He is the CEO of SuperH. Meanwhile,Jean-Marie Rolland, a long-time veteran of STMicro, is the COO of the new venture.
Related News
- Hitachi-STMicro venture deliver first 64-bit RISC core that runs at 700-Mips
- Accelerated Technology Now Shipping code|lab Developer Suite for Hitachi's SuperH RISC Processors
- Hitachi, STMicro to develop 64-bit RISC for consumer apps
- STMicro, Hitachi plan new company to develop RISC cores
- Axiomise Names Two Executives to Newly Formed Technical Advisory Board
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |