Foundry model under stress
(01/15/2008 6:25 PM EST)
HALF MOON BAY, Calif. — After years of success, the silicon foundry model may be falling apart. Perhaps a better description is that there are growing cracks in the model. In fact, the semiconductor supply chain is headed towards a "collision course," as leading-edge foundries are falling behind Moore's Law and find themselves stretched too thin, according to analysts.
The "collision course" could result in shortages of foundry capacity in the second half of 2008, said Bill McClean, president for IC Insights Inc., at the Industry Strategy Symposium (ISS) here.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results