ARC Helps STEC's New MACH4 Compact Flash Capture HD Multimedia Content at Twice the Speed Of Competitive Offerings
- New ARC-Based™ MACH4 CompactFlash SSD Delivers 80 MB/s;
- Affords Professional Video Equipment A High Capacity Alternative to Hard Drive
Since 1994 STEC has been a leader in innovative solid state storage technology, with particular emphasis on high performance and high reliability. STEC’s ARC-Based™ MACH4 enhances its SSD offering by providing CompactFlash storage with twice the data transfer rate (up to 80MB/s) of other CompactFlash devices. This performance opens up a new opportunity with professional video equipment manufacturers, who have found hard drives a less-than-optimum storage media for high definition (HD) video. HD video cameras now have an SSD replacement for hard drives, which provide comparable storage capacity, but are smaller, consume less power, have no mechanical vibration, and offer higher performance.
Patrick Wilkison, vice president of marketing and business development at STEC, said, “ARC’s configurable technology has enabled our engineering team to create a highly differentiated product that provides a more optimized computing platform to system OEMs. The result is a solution that delivers higher value by greatly speeding access to stored digital and multimedia content.”
Bill Jackson, vice president of marketing at ARC International, said, “STEC is among our growing list of customers in the solid state storage market who recognize that providing superior performance to their OEM customers is the way to assure product success. We applaud their ingenuity and ability to develop a unique and innovative ARC-Based solution.”
Thriving CompactFlash Market
According to Semico Research, the availability of flash memory with very high storage capacities has spawned nothing short of a revolution in the way consumers and business people regard and access their data. Semico expects this trend to continue. As a result, the Phoenix AZ market research firm is forecasting that the Flash market will experience continued robust growth and by 2012 will ship 1.3 billion units with a market value of $19 billion.
About ARC International plc
ARC International is the world leader in multimedia subsystems and configurable CPU/DSP processors. Used by over 140 companies worldwide, ARC’s configurable solutions enable the creation of highly differentiated system-on-chips (SoCs) that ship in hundreds of millions of devices annually. ARC’s patented subsystems and cores are smaller, consume less power, and are less expensive to manufacture than competing products.
|
Related News
- TSMC Unveils Foundry's First 100MHz Access Speed Embedded Flash IP
- HD Enterprise Class Content Distribution and Delivery Now Enabled with Ittiam's Video Networking System on TI's DaVinci digital media technology
- Chips&Media' HD Video Core Demonstrated in VIA’s new multimedia chipset.
- CEVA Unveils Industry's First Multipurpose Programmable HD Video and Image Processing Platform for Connected Multimedia Devices
- Phison Licenses Virage Logic's ARC(R) 600 Family of Microprocessor Core IP for Use in Their Flash Controller Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |