Tensilica's Xtensa Processors Enable Next-Generation Mobile HD Radio Technology
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Low-Power Chipset Helps OEMs Build Portable Radios and MP3 Players
SANTA CLARA, Calif. -- March 11, 2008 -- Tensilica,(R) Inc. today announced that its Xtensa(R) configurable processor has been designed into the baseband processor in Samsung EM's HD Radio(TM) chipset. The baseband processor, based on a design by iBiquity Digital Corporation, the developer and licensor of HD Radio technology and a Tensilica processor reseller, integrates the memory, SDRAM and flash in a system-in-package measuring just 9 x 9 mm. Including the companion RF (radio frequency) chip, this low-power chip set's total power consumption is 150 mW, making it ideal for a wide range of battery powered portable devices capable of tuning and demodulating AM/FM radio broadcast in both analog and HD Radio digital technology.
"After working closely with iBiquity, it was exciting to see a demonstration of their latest technology, which employs our processors," stated Steve Roddy, Tensilica's vice president of marketing. "Samsung EM has developed an impressive platform that will enable even more new HD Radio consumer product designs."
About iBiquity Digital
iBiquity Digital Corporation is the developer of the HD Radio system. This technology allows AM and FM stations to broadcast digital signals in tandem with their analog signals, providing broadcasters with a platform to offer crystal-clear, CD-quality sound and scrolling text and graphics; as well as multiple channels of programming on the same FM frequency (multicasting) and advanced services such as traffic updates and content...all subscription free. Over 1,600 U.S. HD Radio stations are now on the air, with more than 700 offering additional content via multicast channels. For more information, please visit http://www.hdradio.com and http://www.ibiquity.com.
About Tensilica
Tensilica, Inc., is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors on the market today - including full software toolchain and modeling support - in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica's processor cores provide semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals. For more information on Tensilica's patented, benchmark-proven processors, visit www.tensilica.com.
|
Related News
- BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions
- Samsung Adopts Synopsys' Machine Learning-Driven IC Compiler II for its Next-Generation 5nm Mobile SoC Design
- Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors
- Inside Secure Technology Chosen to Secure Kalray's Intelligent Processors for Autonomous Vehicles and Next-Generation Data Centers
- Synopsys' Next-Generation Embedded Vision Processors Boost Performance up to 100X
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |