Integration skills critical to survival in IP world, keynoter says
![]() |
Integration skills critical to survival in IP world, keynoter says
By Craig Matsumoto, EE Times
March 20, 2000 (5:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000320S0071
SANTA CLARA, Calif. Intellectual property and systems-on-a-chip (SoCs) are critical to the future of semiconductors, but integration capability is critical to the survival of so-called intellectual-property (IP) businesses, according to the keynote speaker at the IP2000 conference on Monday (March 20). Rob Chaplinsky, general partner of Mohr Davidow Ventures (Menlo Park, Calif.), cited Intel Corp. as the only true system-on-a-chip player, with several other companies coming close to that status. But the majority of IP companies remain in the "wannabe" category, Chaplinsky said. That's because providing IP is the easy part. Whether it comes in software form or on a test chip, IP isn't useful until it can be packaged into a functioning IC, Chaplinsky said. "Ask yourself this: Why does a MIPS core cost 25 cents, and you go to QED [Quantum Effect Design Inc.] and th ere's a 100-fold increase in value?" Chaplinsky said the QED part is worth $25 because it is implemented in silicon. In general, Chaplinsky said, IP becomes more valuable as it gets closer to IC form. He picked Intel as the best system-on-a-chip example because it successfully reuses designs from one microprocessor to the next, across differing process geometries. He cited Broadcom Corp. as a close second. "They don't have any special intellectual property in my mind," he said. Rather, Broadcom's competitive advantage lies in its design methodology and integration skills, he said. Chaplinsky named three other companies that come close to Intel's SoC level: ARM Ltd., MIPS Technologies Inc. and Rambus Inc. He also gave a plug to Pivotal Technologies Corp. (Pasadena, Calif.), the analog-IP company financed by Mohr Dav idow, as a company trying to develop integration capability and struggling with the complicated matter of IP support. "We [at Pivotal] totally underestimated, for every IP deal we had, what it costs for support," he said. Chaplinsky also believes that business opportunities abound for companies to become integration specialists, or for IP firms capable of tackling integration. In general, he said, the climate for startups should be good as the stock market continues to reward semiconductor companies, particularly those in the SoC-hungry communications market. "Public markets beget everything," he said, pointing to the mass of Web startups spawned last year. "If the public market loses its appetite, everything falls." Like many others, Chaplinsky believes the current semiconductor upswing is going to be stronger than other industry upswings, driven by the growth of Internet usage. But there's a dark spot in the picture: semiconductors represented just 0.7 percent of all venture funding in the third quarter of 1999. That should improve as high stock valuations draw venture capitalists' attention to semiconductor markets, Chaplinsky said.
Related News
- Synopsys Unveils TestMAX Family of Products to Address Critical and Evolving Test Challenges
- Intel says no LTE-processor integration until 2014
- Chipset Integration Needed Before SuperSpeed USB Takes Off, Says In-Stat
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- BrainChip Extends RISC-V Reach with Andes Technology Integration
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |