Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Altera's Low-Power Cyclone III FPGAs Deliver Highest Integration for Portable Applications
New M164 Package Features Highest Logic, Memory and DSP per Board Area in Power- and Space-Sensitive Applications
San Jose, Calif. -- March 25, 2008 -- Providing designers with the highest density FPGA per board area, Altera Corporation today announced the availability of new 8x8 mm2 packaging (M164) for its family of 65-nm Cyclone® III FPGAs. Designers of space-constrained high-volume applications in consumer, military and industrial markets can now take advantage of the combined lowest power and density leadership of the Cyclone III devices.
“Our customers value small, fast, smart, and low-cost solutions in our Mercury Encoders,” said Paul Remillard, director, electronic systems engineering, MicroE Systems. “We chose Cyclone III FPGAs because of the high functionalityand performance that is provided in the ultra-small 8x8 mm2 package. Furthermore, the low-power, low-heat dissipation of Cyclone III FPGAs makes it easier for us to integrate FPGAs into our new product’s small form factors.”
The new 8x8 mm2 164-pin package with up to 16K logic elements (LEs) extends the Cyclone III FPGA’s high-density small-package offering that includes 14x14 mm2 256-pin (U256) and 17x17 mm2 484-pin (U484) packages. Each of these packages offers the highest amount of logic and I/Os for its footprint, allowing engineers to use FPGAs in new applications, such as handheld radios, satellite phones, I/O modules, and consumer displays.
Cyclone III devices consume 75 percent less power than competing FPGAs while delivering 5K to 120K LEs, up to 4 Mbits of memory and up to 288 digital signal processing (DSP) multipliers. Further, the Cyclone III FPGA family delivers as much as 60 percent faster performance than competing low-cost FPGAs. Built on TSMC’s 65-nm Low-Power (LP) process, the Cyclone III family includes devices that are qualified for commercial, industrial and extended temperatures.
“Many designers of high-volume applications need a solution that provides maximum functionality with the lowest power while using minimal board space,” said Luanne Schirrmiester, director of marketing, low-cost products, Altera Corporation. “Our complete lineup of small packages allows designers with demanding space constraints to use the most advanced high-volume, low-power FPGA in the market.”
For more information about Cyclone III FPGAs, including white papers, handbooks and webcasts, visit www.altera.com/cyclone3.
About Altera
Altera® programmable solutions enable system and semiconductor companies to rapidly and cost effectively innovate, differentiate and win in their markets. Find out more at www.altera.com.
|
Altera Hot IP
Related News
- Altera's Stratix III FPGAs Deliver Advanced Computing Power and Performance in Quasonix's Latest Telemetry Products
- Dolphin Integration's innovative power island construction kit optimizes Low-Power Management
- Cactus Semiconductor chooses Dolphin Integration's Library for their low power, portable medical applications
- Altera Cyclone V GT FPGA Is Industry's First Low-Power FPGA to Achieve Compliance for PCIe Gen2 at 5 Gbps
- Altera Rolls Out Production Shipments of Low-Cost, Low-Power Cyclone IV FPGAs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |