Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
Sunnyvale, CA, March 31, 2008 -- Fujitsu Microelectronics America, Inc. (FMA), a leading global SoC solutions provider, today announced a new collaboration with Prism Circuits, Inc., a leader in serial and parallel interface IP, to develop a single-lane, variable-data-rate SerDes macro. Built using Fujitsu’s 65-nanometer CS200HP process technology, the macro will be available in the third calendar quarter of 2008.
The 2.5Gbps to 10.3Gbps SerDes design supports IEEE 802.3ap, PCIe-Gen1, PCIe-Gen2, XAUI, SATA-1 and SATA-II with provisions for the upcoming SATA-III and PCIe-Gen3. The multi-protocol SerDes features low jitter generation, high jitter tolerance, and support for 8b/10b and 64b/66b coding. The two companies are also collaborating on a 45nm version of the design, to be available later this year.
“The Prism SerDes represents one of our core focuses in high-speed technology,” said Steve Della Rocchetta, vice president of FMA’s Semiconductor Manufacturing Services (SMS) business group. “Our comprehensive IP portfolio, global design expertise, leading-edge 65nm process, which has been benchmarked at up to 40 percent faster than those from other foundries, and advanced package technologies offer customers the ideal platform for their high-performance SoCs.”
“Fujitsu provides the industry’s premier 65-nanometer technology for high-performance applications,” said Sundari Mitra, President and CEO of Prism. “Working together, Fujitsu and Prism meet all the high-speed design, IP, and packaging requirements of our customers.”
Leading Industry Partners, Flexible New IDM Engagement Models
To provide maximum flexibility and unparalleled customer service, FMA has rolled its ASIC and wafer foundry groups into a single entity, the Semiconductor Manufacturing Services business group. The new group is the focal point to support and grow Fujitsu’s ASIC and COT business in North America. The group's vast technical resources include global design teams that have consistently delivered first-pass success in IC development and fabrication for customers. In addition, FMA’s SMS group and its third-party design partners can support customers with a wide range of engagement models, from full-service ASIC to cost-effective COT, to achieve quick time-to-revenue production ramp.
“We offer pure ASIC, pure COT and all flavors in between,” said Della Rocchetta. “We have enhanced this flexibility by working with our fabless ASIC partners to provide every possible option to customers who begin with ASIC designs and migrate to high-volume ASSP programs as their products gain market success and expand into new opportunities.”
Fujitsu offers complete design and technology solutions, from 90nm to 40nm, for high-speed and ultra-low-power applications. The company and its network of design, EDA and IP partners enable customers to develop differentiated products in supercomputer, high-speed networking, digital audio-video, wireless, telecommunication and other leading-edge applications in a timely manner.
About Fujitsu Microelectronics America
Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. The company’s Semiconductor Manufacturing Services (SMS) business group provides complete design services, application-focused IP, experienced local and global design teams, and a flexible IDM business model for COT to full turnkey ASIC customers. For more information please see http://us.fujitsu.com/micro/sms/ or address e-mail to inquiry@fma.fujitsu.com
|
Related News
- TaraCom Introduces SerDes/PHY IPs in 90 and 65-Nanometer
- Virage Logic Introduces First Commercially Available Multi-Time Programmable Non-Volatile Memory Solution at 65-Nanometer Low Power
- ARM High-Speed PHY and High-Performance Standard Cells For 65-Nanometer Platform Adopted By Fujitsu
- True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference
- Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |