Commentary: How to cash in on video IP
(04/02/2008 1:46 PM EDT) - EE Times
Digital video is almost everywhere. And where it isn't now, it soon will be. As a result, the market for digital video intellectual property components--hardware, software, you name it--is wide open, with lots of opportunities for profit. And there are roughly five gazillion vendors jockeying for position within a highly fragmented field.
Companies like ARC and Tensilica are offering programmable (and sometimes customizable) hardware-plus-software silicon IP solutions for chip designers. Imagination Technologies and Hantro (recently acquired by On2) are offering hard-wired silicon IP. Software companies like MainConcept are offering proprietary implementations of standards-based compression algorithms ("codecs"). And then you have a gaggle of other companies, like Droplet Technologies and Ipera, that are selling proprietary algorithms for compression and pre- and post-processing.
Programmable chip vendors, of course, are increasingly providing software IP along with their video chips. For example, the video codec software provided by Texas Instruments for its DaVinci chips. Likewise for FPGA vendors, and for companies promoting massively parallel processors for applications like video post-production and surveillance.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Commentary: How ESL can regain credibility
- Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
- Nextera Video and Adeas Announce SDI Core, SMPTE ST 2022-8, and NMOS IS-09 as the Latest Additions to their Industry-Leading SMPTE ST 2110 Video over IP FPGA Core Set
- Think Silicon Announces a New Scalable Multi-Core GPU Product Suite with Extended Graphics and Video Functionality
- China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says
Breaking News
- Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
- Industry R&D Spending To Rise 4% After Hitting Record in 2020
- Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
- Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
Most Popular
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
- TSMC Boosts Capital Expenditure Budget on Strong Outlook
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
- Value of Semiconductor Industry M&A Agreements Sets Record in 2020
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices