Rambus Signs Memorandum of Understanding with Spansion
Companies Collaborate On Next-Generation Flash Memory Solutions
Los Altos, California, United States - April 23, 2008 -- Rambus Inc. , one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announced that it has signed an agreement for DDR engineering services and a memorandum of understanding for future development of MirrorBit® Flash memory solutions with Spansion® Inc., the world's largest pure-play provider of Flash memory solutions.
Initially, Rambus will provide Spansion with DDR engineering services in support of accelerating time-to-market for robust, high-volume Spansion products. Services include signal integrity simulations, system and package design, and precision in-system voltage and timing margining.
"Flash memory content in electronic devices continues to grow, enabling increasingly innovative and differentiated consumer electronics products," said Ali Pourkeramati, executive vice president, Applications and Platform Engineering, at Spansion. "Our deep Flash memory expertise coupled with Rambus’ signal integrity and memory interface experience will provide an enhanced opportunity to create the next generation of advanced MirrorBit Flash memory solutions."
"With its preeminent expertise in Flash memory, Spansion is ideally positioned to deliver the breakthrough solutions needed by future consumer electronics products," said Martin Scott, senior vice president of Engineering at Rambus Inc. "Together, we look forward to making significant advancements in the capabilities of Flash memory systems."
Rambus and Spansion signed a patent license agreement in early 2007. With a primary focus on the integrated Flash memory market, Spansion solutions are incorporated into electronic products from Original Equipment Manufacturers (OEMs), including the world's top ten handset, consumer electronics and automotive OEMs around the world.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
|
Related News
- Rambus Signs Memorandum of Understanding with Intel
- Tachyum Signs Memorandum of Understanding with MatLogica
- Tower Semiconductor Signs Memorandum of Understanding to Significantly Improve Its Balance Sheet and Financial Position
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Renesas Announces Termination of Memorandum of Understanding and Tender Offer for Proposed Acquisition of Sequans
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |