Dolphin Integration: A Commercial Breakthrough for 'Reduced Cell Stem Libraries'
The traditional CCSL approach of "Complex Cell Set Libraries" mingling all sorts of performance optimizations are facing the dead-end of advanced technological processes, where the complexity of characterization is exploding. The novelty of SESAME is to provide consistent "cell stems" ultimately optimized for each voltage and performance islet possible within a SoC. A number of such optimized SoCs embedding diverse library stems, are already in volume fabrication at diverse processes and foundries. In cases where optimizations are under constraint (e.g. minimal area but with a speed limit) the respective stems can be composed efficiently.
The offering of a RCSL comes timely with the growing diversity of technological process nodes: "Cost reduction with Dolphin Integration’s SESAME results from its simple structure facilitating controlled optimization at both the Synthesis and Place-and-route stages, and we appreciate being among the first to benefit from this timely innovation”, says Mr. C.C. TSAI, CTO of Himax in Taiwan.
Indeed, more and more companies are searching for such a differentiator in view of customer requests, either for lowering power consumption or for reducing silicon costs, and selecting SESAME serves to obtain a better market pull.
Further stems, with a variety of optimization criteria, are in development for all technological nodes between 250 and 65 nanometers.
About Dolphin
Dolphin Integration is up to their charter as the most adaptive creator in Microelectronics to "enable mixed signal Systems-on-Chip", with a quality management stimulating reactivity for innovation.
Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, resilient to noise and drastic for low power-consumption, together with engineering assistance and product evolutions customized to their needs.
More information on SESAME at: http://www.dolphin.fr/sesame
About Himax
Himax Technologies, Inc. (Himax) is a fabless Driver IC Design company founded on June 12, 2001. Headquartered in Tainan (a city in southern Taiwan), Himax has branch offices in Hsinchu and Taipei, with technical support offices in Japan, Korea, and China.
Himax designs, develops, and markets complete driver IC solutions (for example, gate drivers, source drivers, timing controllers, and operational amplifiers) for various TFT-LCD applications, including handsets, digital still cameras (DSCs), camcorders, car navigators, portable DVD players, note book computers, monitors, and TVs.
|
Dolphin Semiconductor Hot IP
Related News
- Dolphin Integration strengthens their portfolio of Standard Cell libraries with the DUAL innovation targeting Low Power designs
- A Patented Breakthrough for all Performances of Dolphin Integration's Standard Cell Libraries
- Dolphin Integration announces a break-through in logic design drastically improving performances
- Dolphin Integration's Panoply of Memories and Standard Cell Libraries for easing the fabrication capacity shortage
- Dolphin Integration completes their catalog of Standard Cell Libraries with a new stem optimized for low leakage: LL-BTF
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |