MoSys, Virage develop next-generation memory compilers for TSMC processes
![]() |
MoSys, Virage develop next-generation memory compilers for TSMC processes
By Semiconductor Business News
February 29, 2000 (9:34 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000229S0004
SUNNYVALE, Calif. -- MoSys Inc. here and nearby Virage Logic Corp. today announced a partnership to develop fourth-generation memory compilers for 0.18- and 0.15-micron logic processes offered by Taiwan Semiconductor Manufacturing Co. Ltd. The new memory compilers will be based on MoSys' single-transistor SRAM technology--called 1T-SRAM--and Virage's Custom-Touch compiler. The goal is to create compilers for extremely high-density memory blocks that are embedded in system-on-chip designs for TSMC's new standard logic processes. The compilers will employ "what-if-analysis" and performance trade-off capabilities early in the design cycle to help speed SoC development, said the two Silicon Valley partners. "Custom-Touch 1T-SRAM compilers for our leading 0.15- and 0.18-micron processes gives customers easy access to high capacity memory required in these designs," Roger Fisher, senior director and corporate marketing at TSMC. The first Custom-T ouch 1T-SRAM compiler is scheduled to become available in the second quarter of 2000. "The MoSys-Virage partnership is committed to proliferating this unique memory technology to enhance productivity and enable system designers to make smart technical decisions without making any unnecessary compromises," said Vin Ratford, vice president of marketing and sales at Virage, based in Fremont, Calif. "For the first time the performance benefits of SRAM and density advantages of DRAM can be combined in a compilable form."
Related News
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
- ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC
- ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |