OCP-IP Releases Survey of Network on Chip Architectures
The survey contains sections on NoC Architecture Comparison, Comparison Criteria, NoC Evaluation Methods, and NoC Router Implementation. NoC Architecture Comparison discusses switching policy, topology, routing, quality-of-service, as well as testing and fault tolerance. NoC Evaluation Methods covers evaluation metrics and example test cases. Router Implementation discusses router parameters, minimum latency, area and operating frequency.
This paper cites numerous examples from literature selected to highlight the contemporary approaches and reported implementation results.
A copy of the survey can be downloaded at: http://www.ocpip.org/socket/whitepapers/
Work on the survey of NoCs paper was completed by Tampere University of Technology and the OCP-IP NoC Benchmarking Group. For the latest up-to-date information on the work of this group please see the OCP-IP Newsletter at: http://www.ocpip.org/pressroom/newsletters/
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE: NOK - News), Sonics Inc., Synopsys (SNPS), Texas Instruments (NYSE: TXN - News), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. For additional background and membership information, visit www.OCPIP.org.
|
Related News
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
E-mail This Article | Printer-Friendly Page |