Design & Reuse

Duolog Technologies Pioneers I/O Fabric Generator for Complex SoC Designs

DUBLIN, IRELAND -- June 6, 2008 -- Duolog Technologies, the Collaborative Design Automationâ„¢ company, announced its new Spinnerâ„¢ I/O fabric generation tool for automated, bug-free I/O fabric synthesis of complex SoCs. Duolog will introduce and demonstrate Spinner at the 45th annual DAC Design Automation Conference in Booth #241.

Duolog's Spinner auto-generates and validates the RTL for the complete I/O layer of an IC from a single-source specification. Using Spinner's Perfect By Constructionâ„¢ methodology, SoC designers can eliminate I/O bugs and greatly simplify the integration effort -- with up to 3x fewer resources, 5x schedule reductions and radically improved quality through sign-off level collaboration on incremental changes.

"Every aspect of I/O integration is growing in complexity," said Ray Bulger, co-founder and CEO of Duolog Technologies. "The number of pins is growing, the number of functions per pin is growing, DFT is far more complex, I/O cells require much more granular control, and power logic and control needs to be embedded. In the midst of this spiraling complexity, SoC design teams are coming under enormous pressure to deliver and maintain a bug-free design right from the start. Quite simply, I/O design bugs can delay system validation, and silicon bugs can kill the chip. At 45nm, one re-spin typically costs more than $4 million, and a three-month re-spin delay can result in a 25 percent loss in revenue. That's why we've built Spinner for fully automated, 1-Click Release of complex I/O fabrics that are Perfect By Construction."

Duolog's Spinner enables a fully automated, bug-free 1-Click Releaseâ„¢ with standardized tool interfaces, extensive coherency checking and a powerful generator framework that delivers bug-free code and specifications.

"The complexity of SoC platform designs is dwarfing the capabilities of semiconductor companies' in-house tools, semi-automated EDA tools primarily developed during the 1990s and even more recent rules-based integration tools," said Mary A. Olsson, Chief Analyst for Gary Smith EDA. "Duolog's approach to automating I/O fabric generation offers a refreshing alternative that can eliminate the I/O bugs that plague today's SoC designs."

Spinner's advanced I/O fabric generation features include:

  • IP-XACT compliant interfaces for Core, Chip, Die and Package as well as I/O layer primitives, such as I/O, DFT and BSR cells
  • Complete SoC I/O Layer specification IDE for pin muxing, I/O Cell control, BSR and package definition
  • Coherency checking to perform an exhaustive range of checks on the I/O specification
  • Auto-Generation of I/O fabric RTL, documentation, validation and software views and IP-XACT interfaces.

"TI has been using Duolog's integration tools since 2002 on our OMAP SoC developments," said Ziad Mansour, wireless SoC Development manager for Texas Instruments. "Spinner fully automates the creation and management of the I/O layers and greatly enhances the quality and timeliness of our deliverables."

Eclipse-based Spinner runs on Windows, Linux or Solaris and is highly interoperable with existing design flows through standards-based interfaces.

At DAC, Duolog's CTO, Dave Murray, will explore Spinner's capabilities in an IP-XACT User Group presentation led by Texas Instruments -- "Using IP-XACT in complex SoC I/O Integration" -- on Tuesday, June 10 from 2 to 4 pm. For more information, visit: http://www.ipxact-ug.org/meetings.htm.

Pricing and Availability

Duolog's Spinner is available immediately with multiple licensing options.

About Duolog Technologies

Duolog, The Collaborative Design Automationâ„¢ Company, is a pioneering developer of groundbreaking EDA tools that enable the flawless and rapid integration of today's increasingly complex SoC, ASIC and FPGA designs. Duolog's Socrates Chip Integration Platform enables IC designs that are Perfect By Constructionâ„¢. The world's leading IP and IC/SoC development companies rely on Duolog tools to automate their chip integration processes -- eliminating bugs, shrinking design cycles and drastically reducing the risk of costly delays and respins. For more information, visit http://www.duolog.com.