NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Wi-LAN Provides Mid-Quarter Update on Licensing Activities
Company confirms eight license agreements signed at mid-point in third quarter
OTTAWA, Canada – June 19, 2008 – Wi-LAN Inc., a leading technology innovation and licensing company, today announced an update on its licensing activities during its third quarter, which ends July 31, 2008.
The Company announced that it has signed running royalty licenses for wireless-related technologies with Sena Technologies Inc. (“Sena”) and Monsoon Multimedia (“Monsoon”). Sena has signed a six-year running royalty license agreement relating to Wi-LAN’s Bluetooth and Wi‑Fi patents. Monsoon has signed a six-year running royalty license agreement relating to Wi‑LAN’s Wi-Fi patents. These two new licensees, along with Xirrus Inc. and ASUSTek Computer Inc. announced earlier in the quarter, brings the total number of wireless licensees signed as of the half-way point in the third quarter to four and the total number signed to date to 25.
The Company also announced that in the third quarter it has signed running royalty license agreements for its U.S. V-chip patent with Shanghai Weixin Electronics Co., Ltd., Yung Fu Technology Electrical Corp., Soultech Limited and Tunbow Electronics Ltd. These four agreements bring the total number of V-chip licensees signed to date to 86.
Licensing discussions continue with many companies and Wi-LAN expects to sign additional agreements in the near future.
Wi-LAN has a large and growing portfolio of more than 300 issued or pending patents.
About Wi-LAN
Wi-LAN, founded in 1992, is a leading technology innovation and licensing company. Our portfolio of patented inventions applies to a wide range of electronics and communications products. Some of the fundamental technologies covered by Wi-LAN’s patents include: CDMA, DOCSIS, DSL, GSM/EDGE, V‑chip, Wi-Fi and WiMAX. Wi-LAN has licensed its intellectual property to over 100 companies. For more information: www.wi-lan.com.
|
Related News
- Wi-LAN Litigation Update
- Wi-LAN Reports Third Quarter 2008 Financial Results
- Wi-LAN and Texas Instruments Agree to Without Prejudice Dismissal
- Wi-LAN Amends Complaint to Add LG to Litigation Against Motorola, RIM and UTStarCom
- Wi-LAN Initiates Litigation Against Motorola, RIM and UTStarCom / Company confirms settlement of Marvell Dispute
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |