Wi-LAN Amends Complaint to Add LG to Litigation Against Motorola, RIM and UTStarCom
OTTAWA, Canada - July 4, 2008 – Wi-LAN Inc. (“Wi-LAN” or the “Company”) (TSX:WIN), a leading technology innovation and licensing company, today announced that it has amended its Complaint in action No. 2:08-cv-237 in the U.S. District Court for the Eastern District of Texas, Marshall Division to add LG Electronics, Inc. and LG Electronics Mobilecomm U.S.A., Inc. as Defendants. The parties already named as Defendants in this action are Motorola, Inc., Research in Motion Corporation, Research In Motion, Ltd. and UTStarCom, Inc. Wi-LAN claims that all Defendants have infringed and continue to infringe Wi‑LAN’s U.S. patents RE37,802 and 5,282,222 by making and/or selling products including mobile handheld devices and other equipment.
Wi-LAN continues to be represented in this action by McKool Smith, a leading U.S. law firm specializing in intellectual property litigation.
About Wi-LAN
Wi-LAN, founded in 1992, is a leading technology innovation and licensing company. Our portfolio of patented inventions applies to a wide range of electronics and communications products. Some of the fundamental technologies covered by Wi-LAN’s patents include: CDMA, DOCSIS, DSL, GSM/EDGE, V‑chip, Wi-Fi and WiMAX. Wi-LAN has a large and growing portfolio of more than 300 issued or pending patents. Wi-LAN has licensed its intellectual property to over 100 companies. For more information: www.wi-lan.com.
|
Related News
- Wi-LAN Initiates Litigation Against Motorola, RIM and UTStarCom / Company confirms settlement of Marvell Dispute
- Wi-LAN Litigation Update
- Wi-LAN Files Motion to Dismiss Marvell Complaint
- Wi-LAN Initiates Litigation for Patent Infringement
- Court Refuses to Strike Wi-LAN's Claim for Punitive Damages against D-Link
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |