CEVA Extends Worldwide Leadership in DSP Licensing
Leading research firm Gartner reports CEVA's share of the worldwide Digital Signal Processor design licensing market at 61%
SAN JOSE, Calif. -- July 8, 2008 -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has been ranked by Gartner, Inc. as the worldwide leader in licensable DSP technology, commanding over 60% of the 2007 Digital Signal Processor licensing market. Gartner's report: Market Share: Semiconductor Intellectual Property, Worldwide, 2007(1), reports that CEVA's overall DSP licensing market share has grown 10% year on year, increasing CEVA's industry leadership over the competition.
CEVA believes that its strong performance reflects the Company's continued success in licensing DSP cores and subsystems to the industry's leading semiconductor and consumer electronics companies. Licensing DSPs for over a decade and spanning six generations of DSP cores, CEVA has concluded more than 250 licensing agreements to date. Today, CEVA's publicly announced customer base includes Broadcom, Infineon, InterDigital, Marvell, Mediatek, Mindspeed, NXP, RadioFrame Networks, Renesas, Samsung, Sharp, Sony, Spreadtrum and Zoran. In 2007, CEVA's customers shipped over 225 million CEVA-powered™ devices to the wireless handset, automotive, consumer electronics and storage markets.
"CEVA is pleased to be ranked by Gartner as the worldwide leader in licensable DSP technology," said Gideon Wertheizer, CEO of CEVA. "We believe our clear leadership is a testament to our relentless commitment to deliver the industry's most extensive portfolio of DSP cores and related technologies. Our strong customer base coupled with tier 1 OEM adoption of our technology allows us to extend our market reach and grow the business to applications where DSP IP has yet to be used."
1) Gartner, Inc. "Market Share: Semiconductor Intellectual Property, Worldwide, 2007" by Ganesh Ramamoorthy and Christian Heidarson, May 15, 2008
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, consumer electronics and storage markets. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2007, CEVA's IP was shipped in over 225 million devices. For more information, visit http://www.ceva-dsp.com/
|
Ceva, Inc. Hot IP
Related News
- CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
- Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere
- CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World's First eNB-IoT Rel14 Solution
- CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012
- New Power Architecture Silicon Roadmap Signals Strong Growth in Existing and New Markets as Power Architecture Technology Extends Its #1 Worldwide 32-bit MPU and 32-bit CPU Market Share Leadership through 2009
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |