Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
GUC Monthly Sales Report - June 2008
Hsinchu, Taiwan, R.O.C. – July 9, 2008 - GUC (TAIEX: 3443) today announced its net sales for June 2008: revenues were NT$782 million, an increase of 2% from May 2008 and an increase of 19% over June 2007. Revenues increased by 43% to NT$4,469 million in the first half of 2008, compared to NT$3,133 million in the same period of 2007.
GUC June 2008 sales report:
Revenues | 2008 [N$ million] | 2007 [N$ million] | YoY Change (%) |
June | 782 | 659 | 19% |
Year-to-Date | 4,469 | 3,133 | 43% |
GUC June 2008 sales breakdown:
Product Items | Revenues [N$ million] | % |
ASIC | 701 | 90% |
NRE | 78 | 10% |
Others | 7 | 1% |
Less: Sales returns & allowances | 4 | 1% |
Total | 782 | 100% |
About Global Unichip Corp.
Founded in 1988, Global Unichip Corporation (GUC) has since been a pioneer in the SoC (System on Chip) Design Foundry industry. GUC is a publicly traded company on the Taiwan Stock Exchange under the symbol 3443. The company is headquartered in Hsinchu of Taiwan, with design centers and branch offices in China, Europe, Japan and the U.S. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC turnkey services. GUC is committed to providing the most advanced and the best price-performance silicon solutions through close partnership with tsmc, GUC’s major shareholder, and other key packaging and testing power houses. With state of the art EDA tools, advanced methodologies, and experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC offers services to customers throughout Greater China, Japan, Korea, North America, and Europe. Our track-record in complex SoC designs has brought benefits to customers in time to revenue at the lowest risk.
For more information about GUC, please visit our company website at http://www.globalunichip.com
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |