High-performance CEVA-TeakLite-III DSP to be deployed in Percello's low-cost, low-power system-on-chip femtocell architecture
SAN JOSE, Calif. -- Sept. 3, 2008 -- CEVA, Inc., a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that fabless semiconductor Percello has licensed the CEVA-TeakLite-III DSP core for the development of advanced femtocell baseband chipsets.
Femtocell access points are an emerging technology providing low-cost, fully integrated handset services for residential and small business environments. Percello's processor architecture leverages the powerful and fully programmable CEVA-TeakLite-III DSP to deliver a highly-integrated and cost-effective Femtocell solution, offering un-precedented levels of performance and functionality.
"When selecting a DSP for our next-generation of cost-effective Femtocell processors, the CEVA-TeakLite-III DSP emerged as the optimal solution, providing the ideal feature set and power/performance balance for our requirements," said Shlomo Gadot, CEO of Percello. "CEVA is widely regarded as the leader in licensable DSP technology and working with a company of their experience provides a tremendous advantage for our Femtocell processor design process."
"Femtocells are poised to have a tremendous impact for the provision of wireless voice and data services in the next few years and Percello is ideally positioned to address this demand with their advanced wireless infrastructure processors," said Gideon Wertheizer, CEO of CEVA. "This latest selection of our DSP cores for Femtocell applications is indicative of our continued expansion into new addressable markets beyond mobile handsets."
CEVA-TeakLite-III™ is a third-generation DSP architecture based on the broadly adopted TeakLite family of DSP cores. The dual-MAC, 32-bit processing architecture also features a 10-stage pipeline, enabling the core to reach operating speeds higher than 550 MHz. CEVA-TeakLite-III address multiple target applications, including, low-cost 2G/2.5G/3G wireless baseband modems, wideband voice and audio processors, portable media players, femtocells, voice-over-IP residential gateways and High Definition (HD) audio applications requiring advanced audio standards such as Dolby Digital Plus 7.1, Dolby TrueHD and DTS-HD.
Percello, a fabless semiconductor company, was founded in 2007 to provide digital baseband solutions for the challenges of the 3G/HSDPA/HSUPA/HSPA+/LTE femtocells market, with emphasis on cost, power, level of integration, development time and flexibility. Percello brings to its customers low-cost, low-power and high-performance digital baseband chips for the UMTS femtocells market, which is the central component in a UMTS femtocell box. Using the Percello chip, femtocell vendors can lower costs and power while increasing communication and networking performance. With Percello's chip inside, operators are able to deliver FMC (fixed mobile convergence) services over low-cost femtocells, which support any existing as well as future UMTS user devices. For more information, visit http://www.percello.com/.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, consumer electronics and storage markets. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2007, CEVA's IP was shipped in over 225 million devices. For more information, visit http://www.ceva-dsp.com/