32-Bit RISC-V Embedded Processor and Subsystem, Maps ARM M-0 to M-4. Optimal PPA,
Viewpoint: Engineers need to move up the design value chain
EE Times (09/10/2008 1:40 AM EDT)
Today, electronics product and design companies face the challenge of maintaining differentiation in a maturing and increasingly sophisticated market. They also face the need to protect product intellectual property (IP) in a globalized design and manufacturing environment, where hardware can be reverse-engineered as fast as new products can be produced. Companies today must find new and better ways of approaching the design problem. As a result, many engineers find themselves in the position of having to take on different roles within the design landscape in order to move up the value chain and remain relevant into the future.
Designers are increasingly constrained by the traditional silo approach, where specialist hardware and software engineers work in virtual isolation. This model isn't sustainable anymore as the world becomes more interconnected and designs move into the soft design realm. To support innovation and sustainable product differentiation into the future, traditional industry specializations must be replaced with more "value-added" design strategies.
What then is going to give us the most realizable design value? To answer this, we need to take a fresh look at the design process as a whole: why these need to link to other external design processes (such as mechanical design, and the supply chain) and why electronics design processes need to unify. In short, we, as designers, have to move up the design value chain.
E-mail This Article | Printer-Friendly Page |
|
Related News
- India needs to develop IPs to move up design chain, says Tensilica exec
- Outsourcing backers say move up food chain, foes question new job claims
- IoT will fire up the Next Generation of Engineers say ARM and UCL
- How chip makers can regain control of their value chain
- Changing SoC Landscape Goes Further up the Supply Chain
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process