Venture capital is losing patience with the fabless
(09/09/2008 7:01 AM EDT)
PARIS — Just as Europe was starting to get the hang of entrepreneurial risk-taking with a handful of promising chip startups the prospects for exits through initial public offerings seem to have dried up. It is the IPOs that give the venture capital companies the big home runs.
A turning away from fabless has been confirmed by one transatlantic venture capital firm that said it plans to invest most of its funds in Internet companies rather than fabless chip companies. This raises questions as to how the next set of chip company startups will be funded.
Late in July, the partners of Partech International Inc. (San Francisco, Calif.) announced the buyout of Partech International Europe, the European arm of the venture capital firm. The buyout was done by the European managing partners Philippe Collombel and Jean-Marc Patouillaud.
Patouillaud, now managing partner, told EE Times that Partech's strategy is to invest mainly in Internet companies with only a minority of funds going towards electronics component companies. Partech's funds amount to $700 million and its European portfolio companies include DiBcom SA, Acco Semiconductor SA, Netsize SA, Alchimer SA, RealEyes3D SA and Dailymotion SA.
"Our goal line is quite clear," commented Patouillaud. "It is all and only about information technologies. Today, if I told you that we want to bet the majority of our capital on semiconductor component niches, you would probably be surprised."
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Imagination Technologies and BAIC Capital announce automotive joint venture
- NXP and Chinese Private Equity firm JianGuang Asset Management to Establish Semiconductor Joint Venture
- Chips Are Down for VCs, Wall Street
- Intrinsic-ID Closes New Round of Financing with Robert Bosch Venture Capital GmbH and Prime Ventures
- Sidense Raises Additional $5.6M Venture Capital
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation