Fujitsu Adopts Tensilica's Xtensa Processor as Baseband Processor for Fujitsu Mobile Phone
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. – September 29, 2008 – Tensilica, Inc. today announced that Fujitsu Limited of Tokyo, Japan, has licensed the Xtensa LX2 customizable processor core as the baseband processor for Fujitsu’s mobile phone.
“We are pleased to have been selected by Fujitsu, a leader in the mobile phone market,” stated Jack Guedj, Tensilica’s CEO. “With the Xtensa LX2 processor core, Fujitsu’s design teams can innovate more quickly while reducing design risks. Our Xtensa products are a good match for baseband DSP applications as they can be optimized to achieve unparalleled levels of speed/power/performance.”
Customizable Processors Ideal for High-Speed Baseband DSP Designs
Tensilica’s Xtensa customizable processors are widely employed by companies for baseband DSP tasks because they can be optimized with specialized instructions that speed the processing of high-speed, real-time data streams.
About Tensilica
Tensilica, Inc., is the recognized leader in customizable applications processors, DSPs and standard IP cores for audio, video, imaging, security, networking, and baseband signal processing. The automated design tools behind all of Tensilica’s customizable applications processor cores powers top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones , consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. . For more information on Tensilica’s patented, benchmark-proven processors, visit www.tensilica.com.
|
Related News
- Tensilica's Xtensa Customizable Processor Used in Panasonic Mobile’s Wireless Baseband Processor
- Tensilica's Xtensa Processor Core Adopted by NEC For NEC's Mobile Phone SOC
- Tensilica Xtensa Processor Powers World's First Digital Broadcast-Enabled Mobile Phone From LG Electronics
- Spreadtrum Adopts Arteris FlexNoC Interconnect IP for Mobile Phone Processor and Baseband Systems-on-Chip
- Fujitsu Signs Multi-Year Corporate License for Tensilica's Audio, Baseband DSP and Dataplane Processor IP Cores
Breaking News
- Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
- Ian Walsh appointed as Sondrel's Regional VP for America
- Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow
Most Popular
- Imagination Technologies announces new capital investment from Fortress Investment Group
- Alphawave Semi: Q2 2024 Trading and Business Update
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
- Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications
- Comcores supports BAE systems as a key partner with JESD204C IP
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |