English
Pivotal, UMC in foundry pact; Avanti links up on libraries
 |
Pivotal, UMC in foundry pact; Avanti links up on libraries
By Michael Santarini , EE Times
December 6, 1999 (2:17 p.m. EST)
URL: http://www.eetimes.com/story/OEG19991206S0026
Analog and mixed-signal core provider Pivotal Technologies and foundry UMC Group have signed a multiyear agreement to prove, supply and support a range of Pivotal's Fulcrum analog and mixed-signal cores for deep-submicron system-on-chip designs.
Pivotal (Pasadena, Calif.) also said it has received $10 million in second-round Series B venture funding.
The partners said the foundry agreement will afford developers broader access to proven components that target their deep-submicron process requirements in communications and multimedia markets. The components will be made available for UMC Group's 0.25- and 0.18-micron processes now and for 0.15 micron in the future.
The $10 million financing round was led by the investment arm of Goldman Sachs. Its completion brings Pivotal a total of $14 million in financing to date. The company said the new funds will be used to expand engineering resources.
Visit www.pivotaltech.com or www.umcgroup.com.
---
Avanti Corp. has announced a joint development effort with Worldwide Semiconductor Manufacturing Corp. (WSMC) to provide Libra-Visa Libraries for the WSMC T14 and C18 foundry processes. Avanti will develop two foundry-process-specific Libra-Visa libraries consisting of standard cells, I/Os and memory compilers.
The Libra-Visa T14 library leverages the WSMC T14 0.18-micron process, which implements an effective gate shrink to 0.14 micron and thus provides a low-power technology solution. The Libra-Visa C18 library will be optimized for WSMC C18, a high-performance 0.18-micron process. Both libraries will be silicon-validated and qualified for the Avanti very deep-submicron SinglePass tool flow.
A pre-silicon-validated release of the Libra-Visa C18 library will be available this month. See www.avanticorp.com.
Related News
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Intel and UMC Announce New Foundry Collaboration
- U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
- eMemory and UMC Qualify NeoFuse IP on the Foundry's 28nm High Voltage Process
- Faraday Geared Up for Data Communication Applications in ASIC Development
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |