Opinion: EDA is not well -- where is it heading?
EE Times (11/06/2008 9:16 AM EST)
EDA is not well. While the largest company, Cadence, has its own problems, many of them self-inflicted, the entire ecosystem of EDA is sick.
There used to be a healthy EDA world. A few years ago, there were: many EDA journalists; Gartner covered EDA; the large Wall Street firms all had analysts covering EDA; many venture capitalists invested in EDA startups; and every quarter, a startup would go public or be acquired for an attractive valuation. EDA was democratizing semiconductor design, pushing it out from its heartland within the large semiconductor companies themselves into system companies, fabless startups and design houses. Life was good. The industry was profitable.
The world's $3 trillion dollar electronics industry is largely dependent on the world's $400 billion dollar semiconductor industry which, in turn, is dependent on EDA, a tiny five billion dollar industry. EDA technology is a requirement for this value chain. But the EDA industry, as currently structured, might not continue to be the place that continues to provide it.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications