VinChip announces USB 3.0 Verification IP for Super Speed USB Devices
November 17, 2008 -- VinChip, the only company to have USB 2.0 Host, Device, OTG, Hub IP and USB Software Stacks today announced a Super Speed USB IP solution consisting of the Device Controller and Verification IP. The solution also includes a Super Speed USB test platform and Device Drivers in WinCE, Linux, and ECOS uCLinux to aid Firmware Development for Mass storage, Video and other applications.
VinChip USB2.0 test bench is the most widely accepted and proven solution for pre-silicon functional verification of USB devices, host controller and USB hubs.
"VinChip has a long and successful history in USB IP development, their contributions help drive USB applications in Taiwan Market" said Nelson Wang, president and chairman, Corelink Technology, Taiwan. "The VinChip Super Speed USB IP solution and verification bench (VIP) will help designers take advantage of the 5Gbps bandwidth in each lane and low power benefits of Super Speed USB and quickly implement it into their target application."
"There are a number of common features between USB2.0 and USB3.0. Also there is a repeat of USB2.0 controller inside the USB3.0 Controller. VinChip has USB2.0 device, host and hub in various flavors. These have been USB certified and also successful in silicon. Besides, VinChip teams of 55 engineers are fully committed to the USB3.0 technology" said Murugesan Jeyachandran, VP Engineering VinChip.
About VinChip Systems
VinChip Systems was founded to fill the design productivity gap brought about by advances in semiconductor manufacturing and reducing product life cycles. Now, OEMs are provided with an opportunity to design an entire system on a chip leading to reduced cost and increased reliability. But, they also face the prospect of designing products whose design and development cycle matches the products’ life cycle and in some cases outstrips the life cycle. VinChip recognized the role of silicon proven intellectual property cores and Design services in the current scenario and has brought in a team of design experts and domain experts with wide experience in developing solutions for Computing, Networking, Consumer electronics, Embedded systems, Avionics and Industrial systems.
VinChip's current focus is on developing IPs for USB3.0, Wireless USB, Mboa Mac, H.264 (MPEG4/part10), and USB2.0, AHB to PCI Bridge, 32-bit RISC CPU and Bluetooth along with associated software stacks and provides design services. VinChip offers substantial cost savings to its customers by providing proven IPs and design services on-site, or at its design centers located in San Jose and India. More information can be obtained on Availability and Pricing at info@vinchip.com.
|
Search Verification IP
VinChip Systems Hot IP
Related News
- USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
- Synopsys Delivers Industry's First Verification IP for USB Power Delivery 3.0
- Evatronix Announces the USB 3.0 Compatible High Speed Hub IP Core with Analog and Digital PHY Options
- Sibridge Technologies USB 3.0 Verification IP offers predictable success for comprehensive verification
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |