Update: Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation (Oct. 17, 2017)
Schild brings extensive non-volatile memory sales experience to OTP pioneer Ottawa, Canada – November 18th, 2008
- Sidense, a leading developer of Logic Non-Volatile Memory (NVM) IP cores, today announced the appointment of Tom Schild as the company’s new Vice President of Sales. Schild will report to CEO and President Xerxes Wania and be responsible for Sidense’s worldwide sales activities as the company’s embedded one-time programmable (OTP) memory products continue to pervade the semiconductor industry.
“Having Tom join the Sidense team is a real coup for us,” said Xerxes Wania. “His knowledge of the embedded memory industry along with his vast memory sales and marketing experience will help Sidense to further grow its position as the premier supplier of secure, reliable and low-cost embedded field-programmable OTP memory.”
Mr. Schild has more than 20 years of semiconductor experience, most recently at Virage Logic where he was VP of Sales for Asia. Prior to working at Virage, he was Senior Director of Business Development and Marketing for the NVM business unit of Impinj. He has also held positions at Bsquare, Digital Equipment and VLSI Technology, including two years of international experience working in Munich. Mr. Schild has a BSEE from Purdue University.
“I am pleased to have the opportunity to work with a dynamic organization such as Sidense with their unique non-volatile memory solution,” said Mr. Schild. “Highly secure embedded memory is now recognized as a necessity in almost every chip being developed and Sidense has the technology and expertise to far outpace the competition as the leader in embedded OTP IP.” About Sidense
Sidense, listed on EE Times 60 Emerging Startups list for 2008, provides secure, dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required. Sidense's patented one-transistor 1T-Fuse™ architecture (U.S. Patent #7402855 and others) provides the industry’s smallest footprint and lowest power Logic Non-Volatile Memory (NVM) solution.
Sidense OTP memory is available at 180nm, 130nm, 90nm and 65nm and scalable to 45nm and below. The IP is available at Chartered Semiconductor, IBM, SMIC, Tower Semiconductor, TSMC and UMC. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, visit www.sidense.com