English
TSMC's Fourth-Quarter Business Guidance Revised
Hsin-Chu, Taiwan, R.O.C. -- December 1, 2008 -- TSMC today announced that fourth-quarter business will be below the company’s previous guidance given on October 30, 2008 due to a reduction of wafer shipment resulting from continuing weakness in global economic conditions. The company now expects fourth-quarter revenue to be between NT$63 billion and NT$65 billion, lower than the previous expectation of between NT$69 billion and NT$71 billion.
The company’s expectation for fourth-quarter gross profit margin is now between 30% and 32%, and operating profit margin is between 17% and 19%, lower than the previous guidance by 4 percentage points each.
The company is expected to release its fourth-quarter results on January 22, 2009.
The company’s expectation for fourth-quarter gross profit margin is now between 30% and 32%, and operating profit margin is between 17% and 19%, lower than the previous guidance by 4 percentage points each.
The company is expected to release its fourth-quarter results on January 22, 2009.
|
||||||
Related News
- TSMC Details Earthquake Impact, Updates 1Q'16 Guidance
- TSMC Wins All Apple's A10 Chip Business, Report Says
- TSMC Updates 1Q'14 Guidance
- TranSwitch Corporation Announces a Business Re-organization and Restructuring in Line with the Company's Growth Strategy and Narrows Guidance for the 3rd Quarter of 2011
- TSMC Announces February 2009 Sales Report and Revises First-Quarter Business Guidance
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |