USB 3.2 Gen2x2 with PIPE 4.3 and USB2.0 with UTMI+ interface
MegaChips Becomes Tensilica Authorized Design Center
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
YOKOHAMA, Japan – December 15, 2008 – Tensilica, Inc. today announced that MegaChips Corporation, of Osaka, Japan, has become an authorized Tensilica design center. Companies needing SOC (system-on-chip) design services in Japan can take advantage of MegaChips’ expertise in the design of video and imaging products as well as communications products.“We are excited to join Tensilica’s Xtensions partner network,” stated Gen Sasaki, assistant general manager, ASSP Business Division, Specific Use Business Headquarters of MegaChips. “Tensilica’s processors are ideal for complex dataplane processing tasks like video and communications. We plan to use Tensilica’s Xtensa® customizable processors in our own designs and to provide design services for our customers.”
“As we grow our customer base in Japan, we are pleased to add MegaChips to our portfolio of service offerings,” stated Chris Jones, Tensilica’s director of strategic alliances. “MegaChips has proven expertise and can help speed SOC design projects for our customers.”
About Tensilica
Tensilica, Inc., is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com .
About MegaChips
MegaChips Corporation (1st section of the TSE: 6875) was established in 1990 as an innovative fabless company dedicated to system LSIs with the goal of integrating LSIs and systems knowledge. Their focus is on the development of cutting-edge system LSIs and systems products incorporating our original algorithms and architecture in the areas of image, audio, and communications, and using the advances they achieve to offer outstanding products and solutions that meet the needs of their clients. For additional information, please visit: www.megachips.co.jp/english/top.html
|
Related News
- Fraunhofer IIS Becomes Tensilica Authorized Design Center Partner
- KPIT Cummins becomes Authorized Tensilica System-on-Chip (SoC) Design Center
- UpZide Becomes Tensilica Authorized Software Design Center; Offers Expertise in VDSL2, LTE, UWB and Baseband Chip Design
- Sibridge Technologies Becomes Tensilica Authorized Design Center
- Rhonda Becomes Tensilica's First Authorized Software Design Center
Breaking News
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
- Sevya joins TSMC Design Center Alliance
Most Popular
- Weebit Nano nears productisation, negotiating initial customer agreements
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
- Sevya joins TSMC Design Center Alliance
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
- Open Compute Project Foundation and JEDEC Announce a New Collaboration
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |