Shanghai, China – December 22, 2008 – S2C Inc., a provider of advanced system-onchip (SoC) design solutions, is pleased to announce today its partnership with Phylinks Ltd., a leading provider of high-speed analog and mixed signal IP core, to distribute an array of PHY Intellectual Properties (IP) in China. Phylinks’ IP products include PCI Express Gen 1 and Gen 2, SATA Gen I and Gen 2, USB 1.1, 2.0 and OTG, IEEE 1394a, and high-speed SerDes PHY cores.
Over 20 million chips have been shipped with Phylinks’ IP worldwide on a variety of foundries and on different processes all the way from 250nm down to 65nm. Moreover, Phylinks’ cores are constructed with a highly modular architecture allowing for easy customization to customers’ desired configuration and rapid porting to the required foundry and process.
“We are pleased to serve our China customers better with a full range of high-speed analog and mixed signal IP core from Phylinks. They are well suited for the market in China where a large percentage of chip designs today are integrating high-speed interfaces onto one single chip”, said Toshio Nakama, CEO of S2C. “Phylinks’ cores are production-proven and have been tested with many of the controller IP that S2C represents from other IP vendors. The new partnership enables S2C to deliver and support total solutions for high speed interface designs in China for applications such as SSD, HDTV, Set Top Box, IPTV and Smart Phones.”
All Phylinks cores are available today in China, through S2C. For more information, please contact firstname.lastname@example.org.
Phylinks Limited provides a portfolio of IP cores for the design of physical layer (PHY) high speed serial interfaces. Phylinks cores can be implemented in a variety of chip designs for use in advanced PCs, PC peripherals, servers, 3G communications devices, consumer electronics and multimedia devices. Phylinks has offices in Manchester, U.K., and San Francisco, California. For more information, visit www.phylinks.com
Founded and headquartered in San Jose, California, S2C is the leading total solution provider in facilitating systems to chip innovations. S2C has four solutions for systemon- chip (SoC) development:
- Rapid SoC prototyping on Field Programmable Gate Array (FPGA)
- Third-party silicon intellectual properties (IP)
- SoC design, prototype and production services
- Customizable, zero mask-charge, no minimum order eASIC semiconductor devices
S2C’s value proposition is our highly qualified engineering team and customer-focused sales force that understands our customers’ commercial needs in SoC development. S2C’s unique FPGA-based electronic system level (ESL) solution, using our patented TAI IP technology, enables designers employ silicon IP to quickly assemble SoC prototypes on FPGA easily and securely, thereby enabling customers to start software development, typically the long pole item in development schedules, immediately. Combining rapid prototyping methodologies with a comprehensive portfolio of silicon IP and advanced design solutions, S2C can reduce the SoC design cycle by up to nine months.
S2C currently has 3 direct offices located in Shanghai, Beijing and Shenzhen to meet the demand for accelerated SoC design activities in China. S2C is also the organizer of the annual SoCIP seminar and exhibition in China, which brings SoC designers/professionals from the Asia-Pacific region together with international silicon IP and SoC solution vendors.