Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Stellar and Sican team up on cores
IP99: Stellar and Sican team up on cores
By Peter Clarke, EE Times
November 3, 1999 (10:38 a.m. EST)
URL: http://www.eetimes.com/story/OEG19991103S0011
EDINBURGH, Scotland Two providers of intellectual property (IP) cores, Stellar Semiconductor Inc. (San Jose, Calif.) and Sican GmbH (Hannover, Germany), announced a marketing and sales agreement at the IP99 Europe conference and exhibition. The agreement calls for Sican, which provides cores and design services, to market and sell Stellar's IP cores alongside Sican's existing library of core products, and to provide design services to the customer base of Stellar, which sells graphics and video processing cores. "The IP core offerings from the two companies complement each other and our combined strength will greatly enhance Sican's ability to provide a robust set of cores for customers who are designing system-on-a-chip multimedia solutions in Europe," said Valentin von Tils, vice president of design for Sican. Sican offers audio and video decoding, broadband media access and bus interface cores. The company specializes in multimedia, communications, and networking applications and also provides design services. "Stellar is establishing a worldwide presence. We have already opened an office in Japan and our partnership with Sican will significantly increase our presence in the European multimedia market," said Sandeep Gupta, chief executive officer of Stellar Semiconductor. Stellar's target customers include semiconductor manufacturers developing system-on-chip products for the visual entertainment markets, including digital entertainment systems and consumer information appliances.
Related News
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Innova finalizes its flow and resource management software platform and opens up to the international market
- IAR, Nuclei, and MachineWare Join Forces To Speed Up Innovation in RISC-V ASIL Compliant Automotive Solution
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Breaking News
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
- Faraday Reports First Quarter 2024 Results
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |