Logic Corporation introduces open standard ZSP400 digital signal processor core
Superscalar ZSP400 core is available for licensing and customer developed system on a chip applications providing designers with the ultimate DSP engine
MILPITAS, CALIF., November 1, 1999 LSI Logic Corporation (NYSE: LSI) today announced that it has added its first digital signal processor (DSP) core based on the ZSPTM DSP architecture. LSI Logics ZSP400 core is targeted at customer developed system on a chip (SOC) designs. This announcement signals the availability of the ZSP400 core for customer driven designs utilizing CoreWare® methodologies for their ASIC implementations.
The ZSP400 can be optimized for specific application requirements, such as speed, power dissipation and die size. The resulting design will be characterized as a proven design element for customer utilization through LSI Logics CoreWare design program. The customers will benefit from the flexible design flow while achieving the confidence of Right-First-TimeTM designs.
The ZSP400 product enhances LSI Logics existing OakDSPCoreâ offerings, extending performance to over 400 million multiply-accumulates (MMACS) per second for a single ZSP400 core. The ZSP400 is based on the powerful open standard ZSP architecture, and can be licensed or combined with LSI Logics proven application specific integrated circuit (ASIC) expertise and manufacturing services.
The ZSP400 core is a four-way, superscalar, 16-bit architecture with dual multiplier accumulators clock speeds at up to 200 MHz. The ZSP400 core can be targeted at a variety of LSI Logic processes and performance requirements, within a 3.5 to 5.5 square millimeters die area, designed in LSI Logics G12 (0.18um drawn) process. Its RISC-like architecture and proven bus interconnect structure allows designers to easily migrate the technology into their system-on-a-chip designs.
"The ZSP 400 can address a wide range of communication applications," said Giuseppe Staffaroni, vice president and general manager of LSI Logics Communications Products Group. "The performance level of this ultimate DSP engine, coupled with the simple programmers model and efficient compiler, make it ideal for wireless infrastructure, voice-over-network designs, and other high-performance DSP applications."
Future generations of the architecture will also evolve with derivatives ideally suited for portable applications such as digital handsets. LSI Logic is actively developing applications specific standard products (ASSPs) that utilize the ZSP400 core architecture in a number of strategic business units.
About LSI Logic www.lsilogic.com
LSI Logic Corporation (NYSE:LSI), The System on a Chip Companyâ , is a leading supplier of custom high-performance semiconductors with operations worldwide. The company enables customers to build complete systems on a single chip with its CoreWareâ design program, thereby increasing performance, lowering system costs and accelerating time to market. LSI Logic develops application-optimized products in partnership with trendsetting customers and operates leading-edge, high-volume manufacturing facilities to promote submicron chips. The company maintains a high level of quality, as demonstrated by its ISO 9000 certifications. LSI Logic is headquartered at 1551 McCarthy Blvd., Milpitas, California 95035, 408-433-8000.
Notes to Editor:
- The LSI Logic logo design, The System on a Chip Company and CoreWare are registered trademarks and ZSP is a trademark of LSI Logic Corporation.
- OakDSPCore is a registered trademark of DSP Group, Inc., used under license.
- All other brand or product names may be trademarks or registered trademarks of their respective companies.
- Please do not assign a Reader Service number to this release.
Related News
- LSI Logic Corporation Introduces Open Standard ZSP400 Digital Signal Processor Core
- Western Digital Delivers New Innovations to Drive Open Standard Interfaces and RISC-V Processor Development
- Freescale Introduces Industry's Highest-Performance Fully Programmable Digital Signal Processor
- LSI Logic announces ZSP Digital Signal Processor Core Module boards for ARM+DSP solution
- IBM licenses LSI Logic's ZSP digital signal processor for ASICs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |