Philips announces first 'fully-integrated' telematics processor
Philips announces first 'fully-integrated' telematics processor
By Semiconductor Business News
February 8, 2002 (5:03 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020208S0097
EINDHOVEN, the Netherlands -- Philips Semiconductors today said it is now sampling the first "full-integrated" telematics processor. The SAF3100 combines a microcontroller core, 12-channel GPS baseband circuitry, dual 14-bit analog-to-digital converter, embedded RAM, CAN-bus controller, and high-speed UARTs for interfacing to a cellular phone. "Ease of integration and cost will dramatically affect how quickly telematics solutions are brought to the mass market," said Niko Veenstra, senior marketing manager for Car Infotainment Systems at Philips Semiconductors. "We are the first company to offer a cost-effective, fully-integrated telematics processor, already compatible with a corresponding front-end device." Philips' SAF3100 telematics processor is being aimed at global positioning satellite (GPS) positioning and tracking applications, off-board navigation, automatic emergency call systems, and remote-controlled vehicle functions and diagn ostics. The dual 14-bit A-to-D converter enables connection to a gyroscope for dead-reckoning positioning of vehicles, said the Dutch chip maker. The SAF3100 is compatible with Philips' UAA1570 GPS front-end device. Philips said the telematics processor will also be compatible with a new UAF1572 GPS front-end, which has been designed to dramatically reduce external component count and overall cost of materials while lowering power consumtion. The new front-end device will be available in the third quarter. Samples of the telematics processor are available now and volume production is scheduled to begin this month, said Philips. Pricing on the processor was not immediately available.
Related News
- Wind River Expands Hardware Assisted Tools Strategy, Supports MIPS, Hitachi, ARM Processor Families with Comprehensive, Fully-Integrated Tool Suite
- OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory
- Synopsys Announces Industry's First ASIL D Ready Dual-Core Lockstep Processor IP with Integrated Safety Monitor
- S3 Group announces world's first fully integrated, single conversion radio to be used in devices, transceivers and modem operating off the Iridum network
- PLDA and GUC Delivers Fully Integrated PCI Express Gen 4 Solution for TSMC's 16nm FinFET Plus Process
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |