EverOn Ultra Low Voltage Embedded SRAM TSMC 40ULP Embedded Flash
CEO Interview: Moshe Gavrielov of Xilinx
February 11, 2009
London — Moshe Gavrielov (pictured), the relatively new CEO of Xilinx Inc., came to London to launch Xilinx's Spartan-6 and Virtex-6 ranges of FPGAs and to spread a little celebration around the world " celebration of Xilinx's 25th birthday. In a difficult environment Gavrielov reckons that FPGA-makers are sitting in some of the better seats.
EE Times Europe: Could you comment on the current economic situation and whether price deflation could take hold in the semiconductor sector?
Moshe Gavrielov: Well in our fourth quarter sales were down 5 percent from Q3. But that is better than most other semiconductor companies. The consumer sector is getting hit hardest and soonest. We don't have an enormous amount of exposure to the consumer sector. We have high hopes for Spartan-6 but consumer is not a high level of application for us. We are mainly used in military and communications, some industrial. We are projecting calendar Q1 to be 15 to 25 percent down. I don't think anyone is seeing improvement until the second half of 2009. It's going to get worse before it gets better but I think we're doing better than most.
EE Times Europe: Who is making your Spartan-6 and Virtex-6 silicon; Samsung and UMC?
E-mail This Article | Printer-Friendly Page |
|
Xilinx, Inc. Hot IP
Related News
- Xilinx CEO Moshe Gavrielov Announces Retirement
- Xilinx CEO: Venture capital won't return to semis
- Xilinx CEO Interview: Programmable Processing
- Interview: Roelandts, president and CEO of Xilinx discusses the shifting balance between FPGAs and ASICs, the role of FPGAs in consumer electronics and supply chain gains
- CEO Interview: Charlie Janac of Arteris -- "Pick a Viable Path, Don't Give Up"
Breaking News
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal