Rumor mill: UMC to join IBM 'fab club'?
(02/11/2009 12:49 PM EST)
SAN FRANCISCO -- Rumors at ISSCC and other events are that Taiwan foundry vendor United Microelectronics Corp. (UMC) is mulling over plans to join IBM's ''fab club.''
At present, UMC is developing leading-edge process technology by itself. This is a costly effort--even for Intel.
UMC has a 45-/40-nm process, but can it do 32-nm and beyond? It can barely keep up with rival TSMC.
To help its efforts, UMC recently joined Sematech. But UMC is also looking to join IBM's technology platform alliance, sources said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation