BitSim AB and the Swedish Institute of Space Physics in Uppsala (IRF) have signed an agreement for electronics development with AD-conversion and signal processing for breakthrough radio research
IRF's method is based on the latest years' breakthrough in quantum optics, quantum communication, and quantum encryption and has been transposed to the radio area where the information can be extracted under the control of software.
The project is partly financed by the National Science Foundation in the US and VINNOVA in Sweden (Swedish Governmental Agency for Innovation Systems).
BitSim is supplying a carrier card and will develop an FPGA Mezzanine Card, according to the new ANSI/VITA 57 standard.
The card will implement a four channel Analog to Digital Conversion with external ADC devices. The signal processing will be handled by a Xilinx Virtex-5 FPGA.
The receiver and the breakthrough radio methods will be tested and calibrated in the new anechoic antenna chamber at the Ångström Laboroatry financed by the Knut and Alice Wallenberg Foundation. About ten receivers will then be deployed at radio observatories in the USA, Norway, and Sweden.
More information about the research project can be found at www.lois-space.net.
About BitSim
BitSim AB is a leading consultant and design house in Sweden focusing on electronic design and embedded SW for Board and Chip development. The company has one of Sweden's largest independent electronics development groups in six offices.
Some key areas are System-on-Chip/ASIC/FPGA, Embedded Linux, Digital Signal Processing, Video/Graphics, and High-Speed Design.
|
Related News
- A license agreement has been signed between Gaisler Research and Saab Ericsson Space AB for the use of the Gaisler Research Floating Point Unit
- Gaisler Research AB and Gleichmann & Co. Electronics GmbH signs agreement covering the use, marketing and sales of the LEON processor
- Chips&Media was reportedly signed a contract to supply ISP IP package for IP cameras intended for surveillance market
- Electronics and Telecommunications Research Institute (ETRI) joins HEVC Advance
- Xilinx and China Mobile Research Institute Collaborate on Next Generation Fronthaul Interface Development for 5G Wireless Networks
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |