Test, Packaging & Delivery - Through Partnership, Moortec Offer Total ASIC Solution
Plymouth, UK - Feb 20, 2009 - Moortec have enhanced their Custom Chip offering through partnership and now provide a Total ASIC solution to industry. In addition to IC design, layout and verification Moortec can also manage test solution developments, production testing of wafers and component packaging. This includes devices for application areas such as high speed digital, mixed-signal, RF and data communications. Moortec is well positioned to work with a range of supply-chain partners including leading foundries, assembly houses and test system manufacturers - to ensure successful ASIC delivery.
Moortec, established in 2005, provides high quality analogue and mixed-signal IP blocks for system on chip (SoC) semiconductor devices. Moortec also provide Custom Chip solutions to industry for a wide range of applications. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products.
|
Related News
- Siroyan to offer "test drive" of high-performance DSP core through Sonics' web-based SOCworks evaluation environment
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |