The world's No. 1 memory chip maker expects continued solid demand for its high-performance memory chips
www.kedglobal.com, Jul. 31, 2024 –
Samsung Electronics Co. expects it will be ready to ship its fifth-generation high-bandwidth memory (HBM) chips, or HBM3E, in the second half, demonstrating its confidence in obtaining orders from Nvidia Corp. after posting stellar chip business results for the second quarter.
"We delivered our eight-layer HBM3E samples to our key customers early last quarter when we prepared the chip's ramp-up for mass production, and its qualification test is underway without any issues," Kim Jae-june, executive vice president of Samsung's memory chip business, said during an earnings conference call on Wednesday.
"We expect (HBM3E's) mass production will begin in the third quarter."
The company is also ready to mass-produce the industry's first 12-layer HBM3E chips and will expand supply to multiple customers in the second half, according to the company.
Considering that HBM supply volumes are determined in advance based on contracts with customers, Samsung's confirmation of its high-end memory chip's mass production schedule raised expectations that the South Korean chip giant will soon pass Nvidia's qualification test for its HBM3E chips.