Qualcomm defines format for 3-D chip stress

Rick Merritt, EETimes
9/22/2010 5:24 PM EDT

SAN JOSE, Calif. – Qualcomm has teamed up with Synopsys to define a new data exchange format it believes could be critical for supporting 3-D chip stacks that use through silicon vias. Qualcomm has already gotten support from at least one foundry and one chip assembler for the so-called Stress Exchange Format.

"We think industry needs to get together on this, everyone needs this enablement—we'll compete on other things," said Mark Nakamoto, a Qualcomm engineer.