Aug. 07, 2025, Aug. 07, 2025 –
Teledyne e2v has announced the immediate release of Engineering Models for its latest 16GB radiation-tolerant DDR4 memory, marking a significant expansion of its space-grade DDR4 portfolio. Already recognized as the industry’s most widely adopted solution, the portfolio has seen the successful deployment of hundreds of 4GB and 8GB flight models across various space missions.
The new 16GB DDR4 device preserves the compact dimensions of its predecessors—measuring just 15mm x 20mm x 1.92mm—and is fully pin-to-pin compatible with existing 4GB and 8GB variants. This seamless compatibility offers system designers a clear upgrade path to higher memory capacity without necessitating a complete redesign of their PCBs.
Optimized for interoperability, the memory device is fully compatible with leading space-grade processors and FPGAs, including Teledyne e2v’s own LS1046-Space, LX2160-Space, and QLS1046-Space platforms. With data transfer speeds reaching up to 2400MT/s, the device is built to perform reliably in the extreme conditions of space. It offers a Total Ionizing Dose (TID) resilience of up to 100 krad (Si), immunity to Single Event Latch-up (SEL) exceeding 60 MeV·cm²/mg, and incorporates advanced mitigation for Single Event Upsets (SEUs) and Single Event Functional Interrupts (SEFIs), ensuring no data loss and dependable recovery mechanisms.
The availability of Engineering Models enables developers to begin early integration and validation activities well in advance of flight-readiness. Teledyne e2v provides extensive technical documentation to support integration efforts, including the most recent radiation characterization report for the 16GB DDR4 memory. Customers interested in evaluating the new memory solution are encouraged to contact their Teledyne representative for further information and support.