Counterpoint Research Forecasts in Latest Memory Semiconductor Market Analysis
www.businesskorea.co.kr, Sept. 24, 2025 –
A forecast suggests that Samsung Electronics will surpass a 30% market share in the high bandwidth memory (HBM) market next year. Despite struggling in the first half of this year, lagging behind SK hynix and U.S.-based Micron Technology, analysts predict that Samsung’s sales volume will increase as its next-generation product, HBM4, fully enters NVIDIA’s supply chain.
According to the latest memory semiconductor figures released by market research firm Counterpoint Research on Sept. 24, SK hynix led the HBM market in the second quarter with a 62% market share. Micron ranked second with 21%, while Samsung Electronics came in third with 17%. This means that Korean companies produce 8 out of 10 HBMs globally.
Counterpoint projected that although Samsung Electronics recorded a lower-than-expected market share in the second quarter, it will exceed a 30% market share in the HBM market next year. This is attributed to the company’s imminent certification of HBM3E products for major customers and its ability to expand market share based on HBM4 exports next year.
Samsung Electronics has introduced its 10-nanometer class 6th generation (1c) DRAM process, which is one step ahead of HBM4, along with its 4-nanometer foundry process. In July this year, the company completed the development of HBM4 using the 1c nano process and shipped samples to major customers, with mass production expected to be established by the end of the year. The HBM4 being developed by Samsung Electronics is known to have improved power efficiency by 40% compared to the previous generation by increasing cell integration density, and its data processing speed is said to reach 11Gbps. As soon as development is completed, the company has recently resumed construction of its Pyeongtaek Plant 5 (P5), which had been halted to implement an "economies of scale" strategy.
Counterpoint anticipates that the dominance of Korean companies in the HBM market will be further solidified when HBM4 is released. SK hynix, the leader in HBM, has completed the development of HBM4 and recently established a mass production system. If it passes quality tests, it is expected to be incorporated into NVIDIA’s next-generation artificial intelligence (AI) graphics processing unit (GPU), Rubin, which is scheduled for mass production at the end of next year. While Chinese companies are attempting to catch up technologically by developing HBM products, they have not yet been able to properly implement them due to the high level of difficulty.
Choi Jung-gu, a senior researcher, analyzed, “China is pursuing the development of HBM3 centered on CXMT, but has not yet solved technical issues such as operating speed and heat generation. The shipment, which was initially expected this year, is likely to be possible only in the second half of next year.” He added, “Huawei’s recently controversial in-house HBM is also judged to be an early-stage product with a speed less than half that of typical HBM products.”
출처 : Businesskorea (https://www.businesskorea.co.kr)