Nov. 17, 2025 –
MALTA, N.Y. -- GLOBALFOUNDRIES Inc. (GF) (Nasdaq: GFS) today announced preliminary financial results for the third quarter ended September 30, 2025.
Key Third Quarter Financial Highlights
- Revenue of $1.688 billion
- Gross margin of 24.8% and Non-IFRS gross margin(1) of 26.0%
- Operating margin of 11.6% and Non-IFRS operating margin(1) of 15.4%
- Net income of $249 million and Non-IFRS net income(1) of $232 million
- Diluted earnings per share of $0.44 and Non-IFRS diluted earnings per share(1) of $0.41
- Non-IFRS adjusted EBITDA(1) of $573 million
- Ending cash, cash equivalents and marketable securities of $4.2 billion
- Net cash provided by operating activities of $595 million and Non-IFRS adjusted free cash flow(1) of $451 million
"GF delivered a strong third quarter, with revenue, gross margin, operating margin, and earnings per share at the high end of the guidance ranges," said Tim Breen, CEO of GF. "For the fourth consecutive quarter, we saw strong year-over-year revenue growth in both our Automotive and Communications Infrastructure and Data Center end markets. Gross margin expanded sequentially and year over year in the third quarter, as we continue to drive the product mix and profitability of our business. We are also encouraged by the momentum we are seeing with customers across key growth applications, such as our silicon photonics and FDX platforms."
Recent Business Highlights
- In August, GF announced the production release of its Complementary Bi-CMOS (CBIC) platform, the company’s high-performance silicon germanium (SiGe) technology capable of serving several key markets including smartphones, wireless infrastructure, optical networking, satellite communications and industrial IoT. A major milestone in GF's SiGe roadmap, CBIC combines industry-leading transistor performance with a low-mask count process, and sets a new benchmark for markets that need high-speed, energy-efficient connectivity.
- In October, Silicon Labs and GlobalFoundries announced an expanded partnership for GF to manufacture wireless system-on-chips (SoCs) on its new 40nm Ultra Low Power platform out of its fab in Malta, New York. Building upon its existing manufacturing capabilities in Singapore and Germany, this strategic partnership will drive innovation and reinforce important semiconductor supply in the U.S.
- Supported by incentives from the German federal government and the State of Saxony under the framework of the European Chips Act, GF announced in October plans to increase production capacity in its fab in Dresden to more than one million wafers a year by the end of 2028, making it the largest site of its kind in Europe. Driven by the needs of key customers such as NXP, Infineon, Aumovio and Bosch, GF will better serve customers in this critical geography.
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